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Home SoCs HiSilicon Kirin 9000S
Detailed Specifications

HiSilicon Kirin 9000S

Q3 2023
SMIC
8 Cores

General Information

Launch Date
Q3 2023
Fabrication Process
SMIC
Die Size
N/A
Socket Type
Mobile SoC
Instruction Set
ARMv8.2-A 64 bits
Process Node
7nm (SMIC N+2)

CPU Specifications

Core Count
8
Thread Count
8
Microarchitecture
1 x Taishan V120 + 3 x Cortex-A78 + 4 x Cortex-A55
Clock Frequency
1 x 2.62 GHz + 3 x 2.15 GHz + 4 x 1.53 GHz
CPU Performance Score
68

Cache Memory

L1 Instruction Cache
64 KB per core
L1 Data Cache
64 KB per core (big cores), 32 KB per core (A55)
L2 Cache
512 KB per big core, 128 KB per A55 core
L3 Cache
3 MB
Cache Performance Score
66

Memory Specifications

Memory Type
LPDDR5
Memory Bus Width
64-bit
Memory Channels
4
Maximum Memory Size
12 GB
ECC Memory Support
No
Memory Performance Score
72

GPU Specifications

GPU Name
Maleoon 910 MP4
GPU Clock Speed
750 MHz
GPU Core Count
4
FP32 Performance
~1.2 TFLOPS
GPU Performance Score
65

Display & Camera

Max Screen Resolution
4K (3840 x 2160)
Camera Support
Single 108 MP or Dual 50 MP + 50 MP or Triple camera
Max Camera Resolution
108 MP
Image Signal Processor
Dual ISP
ISP Details
Dual 16-bit ISP with support for up to 108MP single camera or dual 50MP cameras, 4K @ 60fps video recording, HDR10+ video recording, Multi-frame AI noise reduction, Zero Shutter Lag, Phase detection autofocus, Real-time bokeh effects, AI scene detection, Night mode with computational photography, Multi-camera video recording, Advanced image signal processing

AI & Neural Processing

AI Performance Score
N/A
NPU Type
Dual-core NPU (Da Vinci Architecture 3.0)
AI Performance (TOPS)
~12 TOPS

Connectivity

Integrated Modem
Integrated 5G Modem
WLAN Support
5G NR SA/NSA, 4G LTE Cat 18, HSPA+, GSM/EDGE
Modem Speed
5G: 3.5 Gbps (DL), 2.0 Gbps (UL), 4G LTE: 1.6 Gbps (DL), 200 Mbps (UL)
Bluetooth Version
5.2
WiFi Standard
Wi-Fi 6 (802.11ax)

Video & Media Capabilities

Video Decode Support
4K @ 60fps (H.264, H.265/HEVC, VP9)
Video Encode Support
4K @ 60fps (H.264, H.265)
Max Video Resolution
4K @ 60fps

Storage & Power Efficiency

Storage Type
UFS 3.1
Thermal Design Power
8W
Power Efficiency Score
64
Overall Efficiency Score
66

Benchmark Results

Geekbench 6 Single
~750
Geekbench 6 Multi
~2800
AnTuTu 10
~650000
GFXBench Aztec
N/A

Security & Additional Features

Security Features
TrustZone, Secure Boot, Hardware-backed Keystore, Secure Payment, 3D Face Unlock, In-display fingerprint support
Additional Features
First Kirin chipset manufactured by SMIC after US sanctions, Breakthrough 7nm chip from SMIC demonstrating advanced domestic capabilities, Mix of Huawei's custom Taishan V120 core and ARM Cortex cores, Custom Maleoon 910 GPU replacing ARM Mali due to licensing restrictions, Manufactured using SMIC's N+2 process (advanced 7nm), Lower clock speeds compared to Kirin 9000 due to process limitations, Integrated 5G modem with SA and NSA support, Quad-channel LPDDR5 memory support, Dual-core NPU with 12 TOPS AI performance, Used exclusively in Huawei Mate 60 series, Symbol of China's semiconductor self-sufficiency efforts, Significant achievement despite sanctions and technology restrictions, Lower GPU performance than Kirin 9000 due to custom GPU, Custom architecture to avoid ARM licensing issues, Good power efficiency for 7nm process, Supports high refresh rate displays, 4K @ 60fps video recording and playback, Wi-Fi 6 connectivity, UFS 3.1 storage support, Represents Huawei's pivot to domestic semiconductor ecosystem, Dual 16-bit ISP with advanced AI imaging, Surprising capability given manufacturing constraints, Competitive mid-flagship performance, Historic significance in Chinese semiconductor industry
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